29/05/2026
🚀 SEI Laser is coming to 𝐈𝐧𝐭𝐞𝐫𝐩𝐥𝐚𝐬 𝟐𝟎𝟐𝟔!
𝐅𝐫𝐨𝐦 𝐉𝐮𝐧𝐞 𝟐 𝐭𝐨 𝟒, 𝟐𝟎𝟐𝟔, the plastics and packaging industry will gather at the 𝐍𝐄𝐂 𝐁𝐢𝐫𝐦𝐢𝐧𝐠𝐡𝐚𝐦, one of the UK’s most important trade fairs for innovation, manufacturing technologies, and new market trends.
📍 𝐇𝐚𝐥𝐥 𝟏𝟏 – 𝐁𝐨𝐨𝐭𝐡 𝐆𝟗𝟎
+ 𝐄𝐮𝐫𝐨𝐠𝐫𝐚𝐯 𝐋𝐢𝐦𝐢𝐭𝐞𝐝
At our stand you’ll discover:
✨ 𝐏𝐚𝐜𝐤𝐌𝐚𝐤𝐞𝐫 – a modular and flexible laser system for different laser job type on mono or multi-layer film structure.
✨ 𝐏𝐚𝐜𝐤𝐦𝐚𝐬𝐭𝐞𝐫 𝐂𝐖-𝐖𝐏 – developed for window packaging applications with high precision laser die cut on paper.
✨𝐏𝐚𝐜𝐤𝐦𝐚𝐬𝐭𝐞𝐫 𝐂𝐖-𝐆𝐏 – engineered for combining speed, precision, and advanced automation for material scoring.
✨𝐏𝐚𝐜𝐤𝐦𝐚𝐬𝐭𝐞𝐫 𝐖𝐃 – designed for material scoring just in web direction. an accurate laser "engraving".
✨𝐏𝐚𝐜𝐤𝐦𝐚𝐬𝐭𝐞𝐫 𝐂𝐨𝐧𝐯𝐞𝐲𝐨𝐫 - a laser solution for reel to piece job.
Come meet our team and explore the future of packaging with SEI Laser technologies!