MB Silicon Systems (Pty) Ltd

12/04/2017

Please note that we will re-open for business as usual on Tuesday 18th April 2017

15/12/2016

11/11/2015

Lest we forget....

13/08/2015

Quectel Wireless Solutions, a leading global supplier of GSM/GPRS, UMTS/HSPA/LTE and GNSS modules, solutions and services, today announced the EC20 and EC20 Mini PCIe modules, the new generation of LTE modules adopt the 3GPP Rel. 9 LTE technology, delivering 100Mbps downlink and 50Mbps uplink data rates and offering multi-band FDD-LTE (B1/B3/B5/B7/B8/B20) along with HSPA and GPRS/EDGE.
EC20 series includes EC20-E (support European FDD-LTE/WCDMA/GSM band), EC20-A (support American FDD-LTE/WCDMA/GSM band, and 5-mode/13-band EC20-C (China FDD-LTE/TDD-LTE/TD-SCDMA/ WCDMA/GSM band), EC20 Mini PCIe contains two variants EC20 Mini PCIe-A and EC20 Mini PCIe-E, which makes them backward-compatible with existing EDGE and GSM/ GPRS networks to ensure that it can connect even in remote areas devoid of 4G or 3G coverage.
“LTE series modules cater to customer demands on 4G networks with more stable network connection and reliable data communication, said Delbert Sun, Quectel Marketing Director. “Moreover, EC20 module is fallback compatible with Quectel UMTS/HSPA+UC20 module in the compact and unified form factor, enabling network migration within a single design while ensuring long-lasting, future-proof applications. LTE modules give customers the ability to embed support for the latest mobile broadband technology in a variety of connected devices and provide an even faster or real long lifetime mobile Internet experience with 4G LTE technology.”
LTE modules support Multiple-input multiple-output (MIMO) technology, a cutting edge antenna technology transmitting multiple data streams on multiple transmitters to multiple receivers. The antennas at each end of the communications circuit are combined to minimize errors and optimize data speed. They also combine high-speed wireless connectivity with embedded multi-constellation high-sensitivity positioning GPS+GLONASS receiver.
A rich set of Internet protocols, industry-standard interfaces (USB/PCM/USIM/NETLIGHT/ UART) and abundant functionalities (USB drivers for Windows XP, Windows Vista, Windows 7, Windows 8/8.1, Linux, Android/eCall/DFOTA/GNSS) extend the applicability of the module to a wide range of M2M applications such as CPE, router, data card, rugged tablet, automotive, security and industry PDA.

11/06/2015

New X-Capacitor Discharge IC – covers 0.1 µF to 6 µF

Power Integrations' next generation CapZero™ two-terminal, X-capacitor discharge IC increases design flexibility by covering 0.1 µF to 6 µF and handling up to 6 kV transient line voltages. By using CAPZero-2, power supply designers only need to qualify a single part number for all their X-capacitor discharge IC applications.
The CAPZero-2 X-capacitor discharge IC eliminates a key source of power losses while allowing power supplies to comply with IEC 62368-1, the new over-arching safety standard covering TVs and IT equipment. Placed in series with resistors that provide a safe discharge path for a power supply’s X-capacitor, the CAPZero-2 device blocks current flow to the discharge resistors when AC voltage is applied, cutting the power wasted in these components to zero. When the AC voltage is disconnected, CAPZero-2 switches on automatically and safely discharges the X-capacitor by closing the circuit and directing the energy away from the exposed AC plug.

08/04/2015

FTDI Chip Introduces EVE Platforms Supporting Development of HMIs with Capacitive Touch

FTDI Chip has further enlarged the portfolio of development modules accompanying its award-winning Embedded Video Engine (EVE) technology - which has helped revolutionise how human machine interfaces (HMIs) are implemented thanks to its innovative object-oriented approach. These latest EVE platforms are targeted at the creation of intelligent display systems using capacitive touch and are based on the FT801 EVE chip released earlier this year. Both of the new modules’ touchscreens are able support from 1 to 5 independent touch points (thus allowing determination of a wide variety of different gestures; rotations, swipes, pinches, zooms, etc.). They can source power at 5V via their 2.1mm power jack, USB Micro-B port or SPI master connector. Alternatively they can be linked to a 3.3V supply via their I2C interface.

The VM801B (where B refers to Basic) is a compact (106.7mm x 68.6mm) development module with a choice of a 5” or 4.3” display, plus an integrated projected capacitive touchscreen and a fitted, plastic bezel (in a choice of black or pearl finishes). Also included in this module are an audio power amplifier, a micro speaker unit and a real time clock (RTC).
The VM801P (where P signifies Plus) has exactly the same size format and all the same features as the VM801B, but on top of that boasts a built-in ATMEGA328P Flash-based microcontroller. This microcontroller (which operates at 16MHz) allows all the necessary data processing to be taken care of and means the module acts as a fully integrated, stand-alone display system which is compatible with the Arduino open source ecosystem. The module is backed by a comprehensive set of Arduino libraries. Its Micro-SD socket can be used for storing application data. A 4GByte SD card packed with useful application examples comes with the module, enabling engineers to get started on their HMI designs straight away. The recently announced Plus board daughter cards can also be made use of - thereby expanding the scope of what engineers can achieve.

The pioneering EVE technology incorporated into the two new modules addresses the display, audio and touch functions. Since it treats images, fonts, sounds, etc. as objects, it dispenses with the large Flash memories, frame buffers and separate audio/touch controllers required by conventional intelligent display solutions, thus lowering bill of materials costs, reducing the board real estate that needs to be allocated and shortening development times.

“Our EVE platforms are already proving very attractive to engineers, allowing them to quickly prototype sophisticated HMI implementations with the minimum of additional resources. With these two new offerings, it is now possible to make use of capacitive touchscreens - benefiting from their greater robustness and the multi-touch operation they deliver,” says Fred Dart, CEO and Founder of FTDI Chip. “The VM801B Basic board is complemented by the VM801P Plus board through which they can tap into the extraordinary popularity of Arduino.”

08/04/2015

FTDI Chip Launches Sophisticated USB 3.0 Interface Solution in Low Pin Count Package
The FT600Q and FT601Q are FTDI Chip’s first generation USB 3.0 products that function as SuperSpeed USB 3.0 to FIFO bridges, providing data bursting rates of up to 3.2Gbps. The FT600Q comes in 56-pin QFN package and has a 16-bit wide FIFO bus interface, while FT601Q comes in 76-pin QFN package and has a 32-bit wide FIFO bus interface. Both these chips support up to 8 endpoints, other than the management endpoints. The endpoints are linked to a configurable endpoint buffers of 16kByte length for IN and 16kByte for OUT.

Both FT600Q and FT601Q support two interfacing modes; the 245 FIFO mode and the multi-channel FIFO mode, and thus provide more flexibility for system designers. The 245 FIFO mode has a simpler protocol, but for more sophisticated customers, the multi-channel FIFO mode supports up to 4 logical FIFO channels and data structures optimised for higher throughputs. The FIFO is provided with a 16kByte configurable buffer.

The remote wake up function on these chips can be used to rapidly bring the USB host controller out of suspend mode. The USB battery charger detection function enables USB peripheral devices to detect the presence of a higher current power source in order to boost charging capabilities. It means that the FT600 can detect connection to a USB-compliant dedicated charging port (DCP) and transmit a signal allowing external logic to switch to charging mode. The IC can also benefit from the higher power delivery capabilities that the USB 3.0 standard supports while still being able to transfer data.

Engineers are furnished with a great deal of flexibility to configure FT600/1Q to their desired application. Among these are multi-function printers, scanners, high resolution video cameras, still image cameras, high definition displays, data acquisition systems, surveillance equipment and medical/industrial imaging systems.

The FT600Q and FT601Q ICs have an operating temperature range that covers -40⁰C to 85⁰C. Catering for a design which incorporates multiple data endpoints, a completely new driver architecture has been developed and optimised to extract full performance from the system whilst maintaining FTDI Chip’s standard D2xx API. Driver support provided allows the device to be used with Windows, Linux and Mac operating systems.

For more information contact us directly on 011 728 4757 or visit www.mbsiliconsystems.co.za and click on the FTDI link.

07/04/2015

The new Nano SIM connector from Gradconn -
When size is everything!

Communication really is making the world smaller. The ever expanding demand for mobile connectivity combined with the desire for smaller lighter devices has led to a number of developments in both mobile devices and SIM cards themselves.

The latest addition to Gradconn's SIM Card Connector family reflects this. CH03-KA, Gradconn's smallest SIM product, is ideal when space is at a premium, for example hand held devices or wearable mobile products. The Nano SIM connector is a 6 contact, push-pull connector that measures 12.3mm x 10.0mm with a 1.55mm profile. It's rated for 1,500 card insertion cycles and has an operating temperature range of -40° to +85°C. Accurate PCB placement is achieved via the locating pegs; hold downs offer PCB retention strength.

CH03-KA is designed for the 4FF Nano SIM card. This format was introduced in 2012 and is currently the smallest SIM available, measuring 12.3mm x 8.8mm. Nano SIM cards are also thinner than Micro & Mini SIM at 0.67mm vs. 0.76mm.The size reduction has been achieved by making the insulator around the contact area smaller. SIM contact arrangements are compatible with the earlier formats.

Contact us directly for more information.